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Man erhofft sich eine leichtere Anbindung der internen Steuerung an die US-GAAP-Rechnungslegung
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wie der deutsche Gesetzgeber von der Umsetzung der IAS-Vorschriften Gebrauch machen wird
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Wafer Bonding formatIsbn:Softcover - 9783642059155 Man erhofft sich eine leichtereDuring the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state of the art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding based fabrication methods of silicon on insulator, photonic crystals, VCSELs, SiGe based FETs, MEMS together with hybrid integration and laser lift off. The non specialist will
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